SLIP 2021

The 23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP), co-hosted with ICCAD 2021, will bring together researchers and practitioners who have a shared interest in the challenges and futures of system-level interconnect, coming from wide-ranging backgrounds that span system, application, design, and technology.  Original submissions in the form of regular technical papers, invited sessions, workshop discussion topics, and posters are welcome. Program content is accepted based on novelty and contributions to the advancement of the field.

Considering the COVID-19 pandemic, SLIP will be held as a virtual event. The accepted papers are published in IEEE/ACM proceedings and listed by IEEE Xplore. Please take this opportunity to submit your abstracts by August 8, 2021 and full papers by August 15, 2021.

Important Dates: 
Abstract Registration: August 8, 2021
Paper Submission: August 15, 2021
Author Notification: August 31, 2021
Final Version Upload: September 10, 2021

Submission Guidelines:
We invite authors to submit papers of 4 to 8 pages, double columned, 9pt/10pt font in ACM proceedings format. To permit double blind review, all papers must remove author information. Authors should submit papers electronically via this link. More details can be found here: Call for Papers.

Organizing Committee
General Chair: Mustafa Badaroglu (Qualcomm, Belgium)
Steering Committee Chair: Dirk Stroobandt (Ghent University, Belgium)
Technical Program Co-Chairs: Brian Cline (Arm, USA) and Ismail Bustany (Xilinx, USA)
Special Session Co-Chairs: Pascal Vivet (CEA, France) and Yuzo Fukuzaki (TechInsights, Canada)
Finance Chair: Ivan Ciofi (imec, Belgium)
Publicity Chair: Poona Bahrebar (Ghent University, Belgium)
Publications Chair: Seungwon Kim (University of California, San Diego, USA)